Certificates
Certification:
EAC, VCCI, RCM, KC, FCC, CE, BSMI
Design
Chassis type:The type of rigid framework onto which is the hosuing for device components.
Desktop
Expansion slots
PCI Express slots version:
3.0
PCI Express x8 (Gen 3.x) slots:Slots in the computer for PCI Express x8 (Gen 3.x), which is a high-speed serial computer expansion bus standard with 8 pins.
2
General
Type:Characteristics of the device.
NAS & Storage Servers
Logistics data
Harmonized System (HS) code:
84714100
Memory
Maximum internal memory:The maximum internal memory which is available in the product.
512 GB
Maximum internal memory:The maximum amount of memory inside a product, usually measured in bytes e.g megabytes (MB) or gigabytes (GB).
512000 MB
Memory slots:Number and type of memory expansion slots, including connector and memory module descriptions.
16
Internal memory type:The type of internal memory such as RAM, GDDR5.
DDR4-SDRAM
Internal memory:A computer's memory which is directly accessible to the CPU.
32 GB
Network
Cabling technology:Type of cable technology performance.
10/100/1000Base-T(X)
Ethernet LAN:An Ethernet LAN (Local Area Network) interface is present, for a wired conection via a cable.
Supported network protocols:Network protocols tested as compatible with this product e.g. FTP,HTML, POP.
CIFS, AFP, NFS, FTP, WebDAV
Networking
Cabling technology:Type of cable technology performance.
10/100/1000Base-T(X)
Ethernet LAN:An Ethernet LAN (Local Area Network) interface is present, for a wired conection via a cable.
Supported network protocols:Network protocols tested as compatible with this product e.g. FTP,HTML, POP.
CIFS, AFP, NFS, FTP, WebDAV
Operating system/software
Compatible operating systems:List of desktop operating systems tested as compatible with this product.
Windows Server 2016
Operating system installed:Type of operating system on a device e.g. IOS on Apple devices, Android for mobile devices.
Windows Server 2016 Standard
Operational conditions
Operating relative humidity (H-H):
5 - 95%
Storage temperature (T-T):The minimum and maximum temperatures at which the product can be safely stored.
-20 - 60 °C
Operating temperature (T-T):The minimum and maximum temperatures at which the product can be safely operated.
0 - 35 °C
Other features
Number of users:The number of people that use or can use this product.
6000 user(s)
Ventilation fan(s):
80 x 80mm x4
Power consumption (standby):The amount of electricity that is consumed when the product is on standby.
145.8 W
Packaging content
Performance
Noise level:The amplitude level of the undesired background noise, usually measured in decibels (db).
53.7 dB
Ports & interfaces
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity:
2
Ethernet LAN (RJ-45) ports:Number of Ethernet LAN (RJ-45) ports (connecting interfaces) in the device. Ethernet LAN (RJ-45) ports allow a computer to connect to the ethernet.
2
Power
Power consumption (typical):Amount of power consumed by this model, often expressed in watts (W). Typical values that manufacturers give are power consumption when off, standby/suspended mode, typical use, maximum usage.
288.49 W
Power supply input frequency:The frequency of the electricity, usually measured in Hertz (Hz), which is supplied by the power supply. Mains electricity in many parts of the world is 50Hz.
50 - 60 Hz
Number of redundant power supplies installed:
1
Power supply:The way in which the product is powered e.g. rechargeable battery, mains electricity connected via a plug and cable.
800 W
Power requirements:
100 - 240
Number of power supply units:
1
Redundant power supply (RPS) support:Additional power supply which can run a computer if the main power supply fails.
Processor
Embedded options available:
Maximum internal memory supported by processor:
768 GB
Maximum number of PCI Express lanes:
48
Memory clock speeds supported by processor:
2400 MHz
Memory types supported by processor:
LPDDR4-SDRAM
Processor codename:
Skylake
Processor lithography:The process which is performed by the processor e.g. CPU (Central Processing Unit).
14 nm
Processor operating modes:Operating modes for the processors that place restrictions on the type and scope of operations for certain processes run by the CPU. This design allows the operating system to run with more privileges than application software.
64-bit
Processor package size:
76.0 x 56.5 mm
Processor socket:Mechanical component(s) that provides mechanical and electrical connections between a microprocessor and a printed circuit board (PCB). This allows the processor to be replaced without soldering.
LGA 3647 (Socket P)
Supported instruction sets:
AVX, AVX 2.0, AVX-512, SSE4.2
Thermal Design Power (TDP):
85 W
Number of processors installed:Number of processors in the product.
2
Processor cores:The number of central processing units ('cores') in a processor. Some processors have 1 core, others have 2 (e.g. Intel Core Duo) or more (e.g. the Intel Xeon E7-2850 has 10 cores).
8
Processor boost frequency:The turbo boost is an automatic, managed accelleration of the processor when one of the cores is overloaded.
3 GHz
Processor frequency:The speed that the microprocessor executes each instruction or each vibration of the clock. The CPU requires a fixed number of clock ticks, or cycles, to execute each instruction. The faster the clocks rate, the faster the CPU, or the faster it can execute instructions. Clock Speeds are usually determined in MHz, 1 MHz representing 1 million cycles per second, or in GHz, 1 GHz representing 1 thousand million cycles per second. The higher the CPU speed, the better a computer will perform.
2.1 GHz
Processor model:The model number for the processor in a computer.
4110
Processor generation:
1st Generation Intel® Xeon® Scalable
Processor family:A family of processors is a group of processors produced by one company over a short period of time e.g. Intel Pentium processors.
Intel® Xeon®
Processor manufacturer:The manufacturer that produced the processor.
Intel
Processor special features
Enhanced Intel SpeedStep Technology:
Intel Trusted Execution Technology:
Intel TSX-NI version:
1.00
Intel Virtualization Technology (VT-x):Simplify Virtualization and Reduce Overheads\nIntel® Virtualization Technology (Intel® VT) helps make virtualization practical by eliminating performance overheads, reducing complexity, and improving security with hardware assistance. Virtualization allows multiple workloads to share a common set of resources so that a variety of workloads can co-locate while maintaining full isolation from each other.
Intel Virtualization Technology for Directed I/O (VT-d):Simplify Virtualization and Reduce Overheads\nIntel® Virtualization Technology (Intel® VT) helps make virtualization practical by eliminating performance overheads, reducing complexity, and improving security with hardware assistance. Virtualization allows multiple workloads to share a common set of resources so that a variety of workloads can co-locate while maintaining full isolation from each other.
Intel VT-x with Extended Page Tables (EPT):
Intel® AES New Instructions (Intel® AES-NI):Added Security with Faster Data Encryption\nThe Intel® Advanced Encryption Standard New Instructions (Intel® AES-NI) enable fast and secure data encryption and decryption for better performance and less risk from timing and cache-based attacks than table-based software implementations. Intel AES-NI supports usages such as standard key lengths, standard modes of operation, and even some nonstandard or future variants.
Intel® Hyper Threading Technology (Intel® HT Technology):Improved Performance for Threaded Software\nIntel® Hyper-Threading Technology (Intel® HT Technology) makes efficient use of processor resources, enabling multiple threads to run on each core and increasing processor throughput. Available on Intel® Core™ and Intel® Xeon® processors, Intel HT Technology helps run demanding applications simultaneously, protect and manage systems, and provide headroom for business growth.
Intel® Turbo Boost Technology:Higher Performance When You Need It Most\nIntel® Turbo Boost Technology 2.0 accelerates processor and graphics performance by increasing the operating frequency when operating below specification limits. The maximum frequency varies depending on workload, hardware, software, and overall system configuration.
2.0
Software
Compatible operating systems:List of desktop operating systems tested as compatible with this product.
Windows Server 2016
Operating system installed:Type of operating system on a device e.g. IOS on Apple devices, Android for mobile devices.
Windows Server 2016 Standard
Storage
Optical drive type:An optical drive uses laser to read optical discs such as CDs, DVDs and Blu-Ray. Some types of optical drive are: CD ROM drive, CR-RW (CD writer) drive, DVD-ROM.
RAID levels:RAID is a storage technology that combines multiple disk drive components into a logical unit for the purposes of data redundancy and performance improvement. Data is distributed across the drives in one of several ways, referred to as RAID levels, depending on the specific level of redundancy and performance required.
0, 1, 5, 6, 10, JBOD
RAID support:The device uses RAID, which is a storage technology that combines multiple disk drive components into a logical unit for the purposes of data redundancy and performance improvement. Data is distributed across the drives in one of several ways, referred to as RAID levels, depending on the specific level of redundancy and performance required.
Number of SSDs installed:
24
Maximum storage capacity:The maximum amount of data that can be stored in the device.
552.96 TB
Weight & dimensions
Weight:Weight of the product without packaging (net weight). If possible, the net weight is given including standard accessories and supplies. Please note that sometimes the manufacturer leaves out the weight of accessories and/or supplies.
17.3 kg
Depth:The distance from the front to the back of something.
724 mm
Height:The measurement of the product from head to foot or from base to top.
88 mm
Width:The measurement or extent of something from side to side.
482 mm
